Panel Warpage and Die Shift Simulation and Characterization of Fan-Out Panel-Level Packaging

Fan-out panel level packaging (FO-PLP) technology using mold first method and large glass carrier (550mm × 650mm) is demonstrated in this paper. Panel warpage and die shift are investigated through finite element analysis (FEA) and Taguchi statistic method. Critical factors affecting panel warpage at different processes are identified. Solution for reducing panel warpage and die shift are provided in terms of structure design and process optimization and suitable material selection. The effect of gravity on panel warpage is also simulated. Modelling gravity reduces panel warpage significantly when the panel is sitting on the table, but warpage increases when the panel is supported along edge, which arises thin panel handling issue and should be carefully considered.