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Silicon Interposer with Cavities and Copper-filled TSVs for 3D Packaging
Silicon Interposer with Cavities and Copper-filled TSVs for 3D Packaging
2010
Rong Zhang
Ricky Shi-wei Lee
Keywords:
Copper
Interposer
Silicon
Composite material
Materials science
silicon interposer
Optoelectronics
Correction
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