CSP mounting reliability with Sn-Zn-Bi in JIEP project

Describes an experiment on CSP joining reliability with Sn-Zn-Bi paste and Sn-Ag-Cu/Sn-Pb balls by heat-exposure and mechanical tests. Reflow was carried out at 210, 220 and 230/spl deg/C in air. The height of the ball array has a key role in the reliability. Aging at 125/spl deg/C did not show any serious degradation.