Multiple beam sub-80‐nm lithography with miniature electron beam column arrays

Miniature electron beam columns have the potential for high resolution, high throughput maskless lithography applications because they can be scaled in number to form high density column arrays with low fabrication costs. This is achieved using manufacturing techniques that leverage rf packaging technologies and standard bulk micromachining and integrated circuit fabrication processes to produce reliable components with repeatable performance characteristics. A 1×4 electrostatic column array designed to target the 45nm node has been built using monolithically fabricated lenses and packages. The lenses, which consist of stacks of patterned silicon and insulator, are mounted to a ceramic package. Internal to the package are traces which carry all interconnects to drive the column. Each column in the array is individually correctable. The monolithic lens design simplifies the pick-and-place assembly of high density column arrays and enables precise column-to-column registration. The design also facilitates s...