SMT mixed soldering process designing parameters integrated analyzing platform

Mixed soldering is widely used in military, aerospace and medical electronics production, lead solder paste is used combined with lead-free components. It is necessary to choose proper soldering process design parameters to ensure the mixed solder joint's high reliability. In this paper, the SMT mixed soldering process designing parameters integrated analyzing platform is developed, which can help the users to design the proper process parameters. Visual C++ secondary development technology is used to build the platform which contains series of steps in designing the mixed soldering parameters. Firstly, the solder joint's three-dimensional shape model is established combined with the solder joint's process designing parameters, the shape model is converted to the finite element model by the platform; Secondly, run the import file to analyzing the solder joint's reliability by finite element method; Finally, neural networks and genetic algorithm is used for optimizing the reliability to get the best solder joint's process designing parameters.