Uniformity and Quality of Monocrystalline Silicon Passivation by Thin Intrinsic Amorphous Silicon in a New Generation Plasma-enhanced Chemical Vapor Deposition Reactor

This work reports the first results of a new generation plasma-enhanced chemical vapor deposition (PECVD) reactor manufactured by Roth and Rau. This large area parallel plate reactor has been especially designed for the manufacturing of silicon heterojunction solar cells which are made of very thin amorphous silicon films over monocrystalline silicon substrates. Layer thickness uniformity below ± 3 % is reported for both intrinsic and doped layer over a 400 × 400 mm 2 area. Moreover, it is shown that the passivation quality is excellent with life-times up to 4.15 ms on n-type FZ silicon substrates. A ± 0.6 % uniformity in open circuit voltage (mean value of 701.4 mV) is achieved over 32 devices having a 4 cm 2 area and an average conversion efficiency of 19.5 %.