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C9.3 Detecting Local Delamination of Power Electronic Devices through Thermal-Mechanical Analysis
C9.3 Detecting Local Delamination of Power Electronic Devices through Thermal-Mechanical Analysis
2021
H Huai
G. Laskin
Markus Fratz
Tobias Seyler
Tobias Beckmann
Alexander Bertz
Jürgen Wilde
Keywords:
Delamination
Electronics
Composite material
Thermomechanical analysis
Materials science
Power (physics)
Correction
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