A process for producing copper distributing wires

A process for producing copper distributing wires in the steps of: - applying a containing a vanadium or titanium film existing primary coating by means of the CVD technique on an object on which a film is to be deposited, wherein the film it contains previously molded holes and / or depressions, wherein a containing of a tetravalent vanadium organometallic compound of the amide type or of a tetravalent titanium organometallic compound containing amide-type existing raw gas and a reducing gas are used and - it, depositing a copper-containing film by means of the CVD technique to fill up so the holes and / or depressions with the copper-containing film, said tetravalent vanadium or titanium-containing organometallic raw materials of the amide type V [NR