Multi-chamber system for etching equipment for manufacturing semiconductor device

PURPOSE: A multi-chamber system in etching equipment for manufacturing a semiconductor device is provided to reduce a size of a chamber system by forming as a multitude of process chamber to a structure of multi-layer. CONSTITUTION: A cassette stage(42) loads a cassette(41) including wafers(1). A rectangular transfer path has a space for transferring the wafers(2). The rectangular transfer path is contacted with the cassette stage(42). A multitude of process chamber(45) is arranged at a side of the rectangular transfer path. A wafer transfer portion(52) is installed at the rectangular transfer path. The wafer transfer portion(52) loads or unloads the wafers(1) leaded on the cassette stage(42) to process chambers(45).