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CDM ESD current characterization — Package variability effects and comparison to die-level CDM
CDM ESD current characterization — Package variability effects and comparison to die-level CDM
2009
Righter
Salcedo
Olney
Weyl
Keywords:
Capacitance
Die (integrated circuit)
Integrated circuit packaging
Electrostatic discharge
Current (fluid)
Engineering physics
characterization
Heat sink
Materials science
Correction
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