Buffering method for thermal lamination and superposed structure for thermal lamination

The invention provides a buffering method for thermal lamination and a superposed structure for thermal lamination, wherein the used buffer material for thermal lamination comprises a first buffer layer, wherein the first buffer layer comprises at least one thermoplastic material layer, the thermoplastic material layer is at least one of thermoplastic film, fiber reinforced thermoplastic material impregnated sheet and sheet material of thermoplastic material after hot press molding, and the thermoplastic material comprises polyethylene glycol terephthalate, Poly(butylene terephthalate), Biaxially oriented polypropylene, polyfluortetraethylene and daiamid. According to the buffering method for thermal lamination and the superposed structure for thermal lamination provided by the invention, the used buffer material for thermal lamination is a composition composed of thermoplastic material or thermoplastic material and other types of buffer materials, the buffering effect is good, the glass yarn interlacing point delamination and cavity blemish inside the base material of laminated boards can be efficiently improved, and the heat resistance of the buffer material for thermal lamination can be improved.