Magnetic Current Imaging using multi path analysis for power short localization

Magnetic Current Imaging (MCI), a sub technique of Magnetic Field Imaging (MFI), has been used for more than a decade to localize shorts at the package as well as die and wafer level in a non-destructive way. One particular hard category of shorts to localize is a short between power and ground; the so called power shorts. We show in this paper that MCI can localize power shorts in a simple way by using a multi current path strategy through multiple scans by connecting different power and ground connections and using magnetic phase image analysis for sharper signal localization.