Solder-attachment inspection method, solder-attachment inspection device, and pcb-inspection system

A solder-printing inspection device (10) measures the volume of solder paste on a land on a PCB and sends inspection-result information, including the measured volume, to an inspection-data management device (102). From an image of the PCB after reflow, a solder-attachment inspection device (30) extracts data on characteristics of the solder site being inspected, and said solder-attachment inspection device communicates with the inspection-data management device (102) to acquire the volume of solder paste at the point corresponding to the solder site being inspected, as measured by the solder-printing inspection device (10). Said volume is then used to infer characteristics of nearby areas for which it is difficult to measure characteristics; the results of said inference are used together with the data on the abovementioned characteristics to compute the wetting height of the solder after reflow; and said height is classified as passing or failing.