Transient liquid phase bonding of Cu and Al using metallic particles interlayers

Alireza Zaheri,Mohammadreza Farahani,Alireza Sadeghi,Naser Souri

Transient liquid phase bonding of Cu and Al using metallic particles interlayers

2021

Alireza Zaheri
Mohammadreza Farahani
Alireza Sadeghi
Naser Souri

The bonding strength, and microstructures of Cu and Al couples using metallic powders as interlayer during transient liquid phase bonding (TLP bonding) were investigated. The interfacial morphologi...

Keywords:

bonding strength
liquid phase
Composite material
Metal
Materials science
Microstructure

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