Implant Processes for Bipolar Product Manufacturing and Their Effects on Device Yield

A major technology conversion is in progess at IBM’s largest bipolar semiconductor manufacturing facility. Ion implantation is being implemented to replace the capsule diffusion process which for years was the most integral part of the IBM manufacturing technology. Implant processes are being used to fabricate subcollector and emitter device elements on IBM’s most advanced logic and memory LSI chips. These products have been qualified with the implant processes and are being routinely manufactured and shipped to computer assembly facilities for applications in a broad series of IBM systems.