Statistical optimization of sampling plan and its relation to OPC model accuracy
2007
In this paper, we seek a systematic strategy for creation of a wafer sampling plan and to determine the relationship
between this plan and the OPC model accuracy. We start our study with the traditional error components analysis of
wafer data. From this, we introduce our methodology of calculating the effective sample size based on each pattern and
its error components. With all the error components separated, the confidence of the estimated mean can be calculated
and, hence, an error bar can be added to each mean of the wafer data. This error bar is then used to determine which
patterns are over-fitting and which patterns require an improved fit. We will present a method of providing an optimized
and economical solution for wafer sampling. With this calculated error bar, the ultimate metric for OPC model accuracy
will also be discussed.
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