Copper surface roughening treatment solution and treatment method thereof

The invention discloses a copper surface roughening treatment solution, which comprises the following components: 98wt% of H2SO4 50 to 150g/L, volume concentration 30% of H2O2 40 to 60ml/L, a silane coupling agent 0.5 to 5g/L, dissolvable zinc salt 8 to 12g/L, a stabilizer 50 to 150g/L, a corrosion inhibitor composition 0.5 to 7.5g/L, and deionized water residual. Through treatment of the copper surface roughening treatment solution, a layer of dense and uniform honeycomb structure is formed on the copper surface, the structure can increase the specific surface area combined with semi-curing resin, and during a laminating process, a crosslinking reaction for resin curing is involved, a chemical bond is formed, and the binding force with the semi-curing resin is further enhanced.