Assembly and the wafer holding member and the processing method of the mounting structure and the wafer

Be Kaee temperature rising and falling is repeated can keep sufficient air-tightness and assembly removal and replacement of can provide wafer holding member and the mounting structure. Its conjugate, a plate-shaped ceramic body, and the annular member, one end portion is bonded via the metal bonding portion on a lower surface of the plate-shaped ceramic body, the other end is joined to the annular member and a metal member of cylindrical, metal member of the tubular shape is shaped to relax the stress caused by the difference in thermal expansion coefficient between the plate-shaped ceramic body and the annular member is set .