Measurements for RF Amplifiers, Bond Wire Fusing and MOS Power Cells

This chapter focuses on several areas regarding measurements (including methodology, test-bed development and measurement of results itself) of experimental results in the framework of an established cooperation with several partners from industry. We give attention to measurements for RF amplifiers, bond wire fusing and MOS power cells. We also include on-chip measurements of RF passive components and pay attention to heat, stress and reliability measurements. Measurements set-ups have been made in close cooperation with ON Semiconductor Belgium (Oudenaarde, Belgium) and with ACCO Semiconductor (Louveciennes, France).