Toward Material Parameters for Modeling Devices Made From an Epoxy-Based Shape Memory Polymer

Designing devices made from epoxy-based shape memory polymers is difficult because few material behavior parameters are available for these materials in the rubbery/shape changing region. This work examines the rubbery state, greater than 20° C above the glass transition temperature (Tg), as an elastomeric regime suited to characterization with simple tension and planar tension experiments. Differential scanning calorimetry (DSC) results show a 70° C Tg, which agrees with prior research. Simple tension experiments at 100° C exhibited nonlinear elastic behavior, and finite element analysis (FEA) agreed with the constitutive behavior exhibited in the experiments. Planar tension experiments exhibited novel results. The stress/strain response was sigmoidal with a significant plateau in stress followed by rising stress to failure. The typical 10:1 gage width/gage length ratio seemed to over constrain the material. The strain to failure is small, and suggests the material behavior is a hybrid of elastic and hyperelastic behavior.Copyright © 2015 by ASME