Novel insulation materials suitable for FOWLP and FOPLP

Build-up process is a highly effective for high-density integration of printed circuit boards. Ajinomoto Build-up Film® (ABF) has become world-wide used insulation build-up material for manufacturing IC package substrates with Semi-Additive Process (SAP) due to their good resin flow, insulation reliability, thickness uniformity, and SAP applicability. As the recent growth of Fan-Out (FO) type packaging technology from its cost advantage and integration benefit, we developed small-sized filler loaded ABF (Nano filler ABF) as a redistribution layer material, LE series as a film type molding compound, and MI series as a liquid type molding compound. Using Nano filler ABF, we demonstrated 2um/2um line and space Cu patterning and $\Phi 5 \text{um}$ laser via interlayer connection. LE and MI performed quite low warpage on both of 12-inch wafer and large size panel due to low CTE, low Young's modulus, high Tg, and consisting of special polymer.