Method and apparatus for controlling the uniformity of the substrate

And dynamically adjustable process kit, dynamically a processing chamber having an adjustable process kit dynamically method for processing a substrate using an adjustable process kit is provided. Dynamically adjustable process kit is to be changed one or both of electrical and thermal state of no process kit altering the physical structure of the process kit, thereby without replacing the process kit, plasma characteristics that can be changed processing result easily. Processing chamber having a dynamically adjustable process kit includes a chamber body including a part of the configured conductive sidewalls so as to be electrically controlled, and a process kit. Process chamber, electrical and a first control system operable to control one or both of the thermal state, operable second control to control the electrical state of a portion of the side wall of the process kit and a system.