Magnetic-field induced anisotropy in electromigration behavior of Sn-Ag-Cu solder interconnects

National Basic Research Program of China [2010CB631006]; Natural Science Foundation of China [51171191, 51101161]; Major National Science and Technology Program of China [2011ZX02602]; National key scientific instrument and equipment development projects of China [2013YQ120355]; Natural Science Foundation of Liaoning Province [2013020015]