Wafer-scale Material-device Correlation of Tellurene MOSFETs

For the first time, thousands of tellurene MOSFETs were batch-fabricated by a CMOS-compatible wafer process. However, the yield was only approximately 1% mainly because the tellurene was nonuniform and discontinuous. Nevertheless, the large-scale material-device correlation confirmed that the thicker the tellurene, the higher the current capacity, but the lower the on/off ratio. Such large-scale material/device correlation can help improve both the material and the device in the future.