High Thermal Conducting Composites Using Percolation Theory

A thermal solution composite is made by incorporating dense inorganic fillers with high thermal conductivity into a resin. Silica, alumina, aluminum nitride, silicon nitride, and boron nitride are used for fillers of thermal solution composite. The thermal conductivities of composites are measured and the effect of inorganic fillers’ volume fraction is analyzed. The influence of percolation on thermal conductivity is considered. When percolation by random filling is assumed, the thermal conductivity of composite materials is expressed by the predictive expression using the effective thermal conductivity of filler. The relationship between the effective thermal conductivity of filler and its mean diameter is estimated by the equation. In the case of irregular AlN filler with average particle size 45 μm, the effective thermal conductivity of filler becomes 20 Wm−1 K−1. When the volume fraction of the fillers is 0.75, the thermal conductivity of the composite has been reported to 8 Wm−1 K−1. If the thickness of the interfacial region can be lowered, an effective larger thermal conductivity of the filler appears to set in and the thermal conductivity of the composite can be largely improved. The thermal conductivity of BN can approach 600 Wm−1 K−1. The BN constitutes the matrix of composite by causing percolation without interfacial region; high thermal conductivity of 55–100 Wm−1 K−1 has been achieved.