Double-Sided Liquid Cooling for Power Semiconductor Devices Using Embedded Power Packaging

This paper presents a double-sided liquid cooling scheme for power MOSFETs using embedded power packaging technology. A liquid module test bed has been built to create various convection conditions and is used with 600-V high-current MOSFET-based embedded power samples to test the effectiveness and feasibility of the proposed scheme. Compared with single-sided liquid cooling, an improvement of 45% to 60% in thermal resistance is experimentally shown, for embedded power with double-sided liquid cooling for a device loss between 5 and 300 W and 0.25 to 4.5 GPM water flow rate. The trend and concept is also validated with physics-based lumped parameter thermal models.