Global modeling approach to the design of an MMIC amplifier using Ohmic Electrode-Sharing Technology

An innovative technique for high--density, high-frequency integrated circuit design is proposed.The procedure exploits the potentialities of a global modeling approach,previously applied only at device level,enabling the circuit designer to explore flexible layout solutions imed at important reduction in chip size and cost.The new circuit design technique is presented by means of an example consisting of a wide-band amplifier,implemented with the recently proposed Ohmic Electrode-Sharing Technology (OEST).The good agreement between experimental and simulated results confirms the validity of the proposed MMIC design approach.