Chip carrier assembly and chip carrier for producing a chip-Gehäusung

A chip carrier arrangement (23) with a chip carrier (23) for producing a chip housing, fitted on a carrier film (20) with conductive tracks (21) which are connected to metallised contact surfaces (40) of a chip on the face of the carrier film facing the chip (39), and the free ends of which form a flatly distributed contact surface arrangement (42) for connection to an electronic component or a substrate. In said chip carrier arrangement, the conductive tracks (21) are arranged on the rear of the carrier film (20), there are apertures (28) in the carrier film (20) in the region of the metallised contact surfaces (40), the conductive tracks are covered by a perforated mask (36) to form the surface contact arrangement (42) and the thickness (s) of the carrier film is smaller or substantially the same as the height (h) of the metallised contact surfaces (40) on the surface of the chip.