0.1 /spl mu/m InGaAs/InAlAs/InP HEMT MMICs - a flight qualified technology

2002 
0.1 /spl mu/m InGaAs/InAlAs/InP HEMT MMIC technology on 3- inch InP substrates has been qualified in the categories of three-temperature lifetest, gamma radiation, RF survivability, electrostatic discharge, via-hole baking, and H/sub 2/ poisoning. The three-temperature lifetest (T/sub 1/ = 215/spl deg/C, T/sub 2/ = 230/spl deg/C and T/sub 3/ = 250/spl deg/C) of 0.1 /spl mu/m InGaAs/InAlAs/InP HEMT MMICs in a N/sub 2/ ambient demonstrates an activation energy (Ea) as high as 1.9 eV, achieving a projected median-time-to-failure (MTF) /spl ap/ 1/spl times/10/sup 8/ hours at a 125/spl deg/C junction temperature. Gamma radiation up to 5 mega RAD dose does not induce any degradation of DC/RF characteristics. Electrostatic discharge (ESD) shows destructive voltage up to 100 Volts. Furthermore, 0.1 /spl mu/m InP HEMTs exhibit less sensitivity to H/sub 2/ exposure than 0.1 /spl mu/m GaAs pseudomorphic HEMTs. The qualification results demonstrate the readiness of 0.1 /spl mu/m InGaAs/InAlAs/InP MMICs technology for flight applications.
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