From an MMIC chip to a working cryogenic low-noise amplifier: a detailed study on packaging

Cryogenic Low Noise Amplifiers, based on MMIC HEMT technology, require a careful packaging to reach optimal performance. Differences between modeled and measured performance can often be related to chip mounting details. In the framework of the development of new cryogenic LNAs, described in a companion paper, we have developed a specific packaging to host W-band cryogenic MMIC LNAs. We present here some of the main factors analyzed in the design and chip integration activities. In particular, mechanical and thermal modeling, LNA chip gluing and adhesive properties, sensitivity to components integration accuracy (i.e. deviation from the ideal orientation). Preliminary test results are also reported.