Simulation model of EUVL mask temperature rise during scanning exposure
2002
A three-dimensional transient heat conduction model for predicting the change in temperature of an extreme ultraviolet lithography (EUVL) mask due to periodic scanning exposure was developed. The transient temperature of a mask was calculated in detail until it reached the steady state. The model predicts that periodic scanning exposure produces a temperature peak even in the steady state. An effective way to reduce the thermal influence on an EUVL mask is to use the combination of a high-sensitivity resist and a long exposure time.
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