Copper plating solution and copper plating method

A copper plating solution comprising a compound having the structure and -XSY- ninhydrin, wherein said X and Y are selected from the group consisting of hydrogen, carbon, sulfur, nitrogen and oxygen atoms of the group, and only when X and Y is a carbon atom which is the same. By using such a copper plating solution, it is possible to obtain good filling hole in the case where there is no deterioration of the coating surface.