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Package-Die Co-optimization for Improved Performance and Lower Cost: A 32nm 10-core Xeon CPU Case Study
Package-Die Co-optimization for Improved Performance and Lower Cost: A 32nm 10-core Xeon CPU Case Study
2011
Srikanth Balasubramanian
Arun Chandrasekhar
David Ayers
Surya Prekke
Bhunesh S. Kshatri
Srikrishnan Venkataraman
Keywords:
Xeon
Parallel computing
Chip
Embedded system
CPU power dissipation
Engineering
Correction
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