Structure has integrated heat dissipation IMPROVED

Laurent-Luc Chapelon,Pascal Ancey,S. Lhostis

Structure has integrated heat dissipation IMPROVED

2013

Laurent-Luc Chapelon
Pascal Ancey
S. Lhostis

integrated structure, comprising a support (7) supporting at least one chip (1) and a heat dissipation case (4) attached to said chip, thermally conductive and thermally expandable manner consistent with said chip.

Keywords:

Chip
Thermal management of electronic devices and systems
Optoelectronics
Materials science
Electrical conductor

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