A kinetic model to study film deposition during dusty plasma chemical vapor deposition process

A simplistic numerical kinetic model to predict the deposited film morphology in dusty plasma chemical vapor deposition reactors is developed. The morphological accretion of a circular object is studied in a two-dimensional geometry and the most important deposition phenomena are taken into account, i.e., surface diffusion and surface ion bombardment. Both isotropic and anisotropic plasmas are considered. It is shown that when the particle is located in an isotropic plasma, the deposited film maintains the original particle sphericity. Whereas, if the particle is assumed to levitate in the (pre) sheath forming around the bottom electrode of the reactor and ions contribute considerably to the deposition, the film develops in a nonuniform manner similar to experimental observations.