Bonded substrates for optoelectronic applications

Bonded hydrophilic (SOI) and hydrophobic wafer pairs are applied as substrates for optical devices (pin-diodes and complex MOEMS). Important parameters of diodes are analysed at temperatures up to 250°C (dark current, photocurrent, CV-curves, rise time). Diodes produced on bonded wafer pairs show a similar or better behaviour than components prepared on the standard epitaxial wafers.