A process for the preparation of an ESD protection in a microelectronic device and correspondingly formed microelectronic module

A process for the preparation of an ESD protection in a microelectronic device having a semiconductor circuit (9) comprising at least two independent power domains (8) with at least one power supply bonding pad (4), wherein between the power supply bonding pad (4) one of the independent power domains (8) and at least one further power supply bonding pad (4) is made of another of the independent power domains (8) a low-resistance electrical connection, characterized, that the low-impedance electrical connection outside the semiconductor circuit (9) in a package of the microelectronic device (1).