A carrier member for manufacturing a substrate and a method of manufacturing a substrate using the same

PURPOSE: A carrier member for manufacturing a substrate and a method for manufacturing the substrate using the same are provided to stabilize a process for manufacturing a printed circuit board by including a release layer to easily separate a rigid substrate from the carrier member. CONSTITUTION: A base substrate(100) comprises a rigid substrate(110). The rigid substrate supports a printed circuit board which is built up. An adhesive layer(130) is laminated on the upper side of the rigid substrate. A release layer(300) includes a first side in contact with the base substrate and a second side to face the outside of the base substrate. The release layer is laminated on the outermost of the base substrate.