Method for forming wiring on surface of three-dimensional structure, intermediate structure for obtaining three-dimensional structure provided with wiring on surface thereof, and three-dimensional structure provided with wiring on surface thereof

The present invention successfully forms a circuit pattern on a three-dimensional structure simply by applying a laser in one direction without changing the arrangement position or the direction of a laser irradiation device or a stage. A convex body (13a) is formed on a surface of an insulating base material (11) by insulating resin (13), a resin coating (14) is formed on a surface of the convex body (13a) and the surface of the insulating base material (11), a circuit pattern (15) having the depth exceeding the thickness of the resin coating (14) is formed by laser processing from an outer surface side, a plating catalyst (16) is deposited on a surface of the circuit pattern (15) and a surface of the resin coating (14), the resin coating (14) is removed, and an electroless plating film (17) is formed only on a region where the plating catalyst (16) remains. At a convex body forming step (B), the convex body (13a) having an inclined surface (13b) inclined to the surface of the insulating base material (11) is formed. At a circuit pattern forming step (D), a laser is applied in the direction perpendicular to the surface of the insulating base material (11).