Laser process optimization for improving Emitter Wrap Through drilling rates
2010
Manufacturing of Emitter Wrap Through (EWT) solar cells relies on fast laser drilling of silicon wafers. A single cell may comprise up to tens of thousands of holes, which need to be drilled at cycle times of a few seconds per wafer. Typically these holes are drilled using pulsed infrared lasers. Combined laser power for requested production rate is a few hundred watts.
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