Fine line metallization by coextrusion technology for next generation solar cells

Abstract This paper introduces the application of a coextrusion printing as a contact and mask-free fine line metallization technology for direct printing of narrow grid lines with a strongly enhanced aspect ratio. Coextrusion printed grid lines enhance short circuit current and lower series resistance through a higher number of filigree fingers. The silver and sacrificial paste that merge inside the nozzle are simultaneously extruded onto the wafer and form a silver paste structure smaller than every design feature inside the nozzle. After contact firing the grid lines become as narrow as 35 µm with an aspect ratio up to 0.7. A further shrinkage potential down to 23.7 µm width with an aspect ratio up to 0.62 has been demonstrated. Coextrusion printed grid lines outperform screen printed grid lines in a whole slew of geometrical and optical properties. As for example grid line width and height variation is as low as ±0.5 µm and the optical effective finger width is far smaller than the screen printed effective finger width. Due to these low effective finger widths the absolute effective shading of 96 coextrusion printed grid lines is less than half of the 80 screen printed grid lines. The calculated short circuit current gain, due to the lower effective shading was experimentally confirmed accordingly. Furthermore a benchmark test in a production like environment was performed. Hereby an absolute cell efficiency gain of +0.25% over screen printed metallization was confirmed and a cell efficiency gain of over +0.35% to +0.4% abs. can be assumed to be achieved by using a direct contacting coextrusion silver paste, which is comparable to state of the art screen printing pastes.