Conductive paste based interconnection for photovoltaic modules

We proposed low-temperature interconnection method using conductive paste (CP) for photovoltaic modules with thin c-Si cells. The advantage of CP approach is significantly reduced thermo-mechanical stress, as a result of the low tabbing process temperature (< 150 °C). The resistivity loss induced by CP based approach is in the same range of module integrated by high temperature tip contacted soldering. Furthermore, thermal cycle and mechanical load tests confirm that CP provides stable interconnection between cell and module (degraded only 0.6%). Hence, unique traits of CP approach indicate that CP soldering is a production-ready alternative for interconnecting thin cells.