Method for checking wafer number of semiconductor chip

2016 
The invention provides a method for checking a wafer number of a semiconductor chip. The method comprises: a probe bench sends a wafer checking starting signal to a work station; the probe bench sends an original wafer number, an original wafer batch number, and an original wafer slot position number to the work station according to a request; decomposition rules of the wafer number and the wafer batch number are obtained; the original wafer number is decomposed into a checking wafer batch number, a checking wafer slot position number and a total checking code; the original wafer batch number is decomposed into a decomposed wafer batch number and a sub batch number; and the decomposed wafer batch number and the checking wafer batch number are compared and the original wafer slot position number and the checking wafer slot position number are compared; if any comparison result dost not match, testing is stopped and alarming is carried out, and an operator is informed of checking and determining. Therefore, on the basis of the relationship of the wafer batch number, the wafer slot position number, and the wafer number, whether the three pieces of information is correct is determined, so that a wafer number reading error is reduced to the greatest extent.
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