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Thermal Cycle Tests of CLCC Solder Joints: Influence of Substrate, Solder, and Pad Patterns
Thermal Cycle Tests of CLCC Solder Joints: Influence of Substrate, Solder, and Pad Patterns
2020
Seisuke Fukuda
Takayuki Ishida
Tetsuhito Arakawa
Tsuyoshi Nakagawa
Hajime Murao
Keywords:
Substrate (chemistry)
Soldering
thermal cycle
Engineering
Composite material
thermal cycle test
Aerospace engineering
Correction
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