Impact of heatsink attach loading on FCBGA package thermal performance

Flip-Chip Ball Grid Array (FCBGA) packages are prevalent in wide range of electronics applications including gaming consoles, mobile gadgets, telecommunications etc. The microelectronics industry is actively shifting towards smaller node sizes (32 nm, 28 nm etc.) and integrating multiple functionalities onto the die. This in turn increases the die power levels and more importantly drastically increases the die heat-flux densities. External heatsinks are typically needed in order to support high thermal power dissipation.