Old Web
English
Sign In
Acemap
>
Paper
>
High-Performance 3D Interconnects Based on Electrochemical Etch and Liquid Metal Fill
High-Performance 3D Interconnects Based on Electrochemical Etch and Liquid Metal Fill
2010
Harry Hedler
Thomas Scheiter
Markus Schieber
Keywords:
Electrochemistry
Liquid metal
Ceramic materials
Materials science
Composite material
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
1
Citations
NaN
KQI
[]