Led of side view type and the method for manufacturing the same

2005 
A lateral LED(light emitting diode) is provided to form a lateral LED having the whole thickness of 0.5 millimeter or lower by sawing an injection material surrounding a leadframe of a reflector by a blade wherein the thickness of the sidewall of the injection material becomes 0.04~0.05 millimeter. A leadframe is prepared which includes a cathode terminal and an anode terminal(S1). A reflector surrounds the leadframe in a manner that the cathode terminal and the anode terminal are partially exposed to both sides of the reflector, including a groove opened upward and a sidewall surrounding the groove(S2). An LED chip is die-attached to the upper part of the leadframe in the groove(S3). The LED chip is bonded to the cathode terminal or the anode terminal by a conductive wire(S4). Liquid hardening resin is dispensed to the inside of the groove to form a lens part(S5). The confronting sidewall is sawed by using a sawing machine so that the thickness of the sidewall on the upper surface becomes 0.04~0.05 millimeter(S6). A silver-plated copper plate material is punched by using a pressing die to form the leadframe.
    • Correction
    • Source
    • Cite
    • Save
    • Machine Reading By IdeaReader
    0
    References
    0
    Citations
    NaN
    KQI
    []