Package Reliability Analysis with Coupled Electro-Thermal and Mechanical Modeling

Power consumption and dissipation during electrical operation lead to a temperature rise in the package. Elevated temperature in the package structure induces thermo-mechanical stresses which may increase reliability risks. Robust and reliable package design for power systems requires comprehensive analysis of system electrical, thermal, and mechanical behavior. This paper presents a self-consistent approach for package reliability analysis with coupled electro-thermal and thermo-mechanical modeling using TCAD tools.