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32nm-node Cu Interconnect technology using density-modulated Low-k film
32nm-node Cu Interconnect technology using density-modulated Low-k film
2007
Munehiro Tada
Hironori Yamamoto
Fuminori Ito
Mitsuru Narihiro
Makoto Ueki
Naoya Inoue
M. Abe
Shinobu Saito
Tsuneo Takeuchi
Naoya Furutake
T. Onodera
Jun Kawahara
Y. Kasama
Toshiji Taiji
M. Tohara
M. Sekine
Yoshihiro Hayashi
Keywords:
Electronic engineering
Materials science
Optoelectronics
interconnect technology
porous film
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