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Bonding Strength Evaluation of Encapsulation Resin for Power Electronic Devices at High Temperature
Bonding Strength Evaluation of Encapsulation Resin for Power Electronic Devices at High Temperature
2016
Toru Ikeda
Akiko Ozaki
Masaaki Koganemaru
Hiroshi Nakaido
Takuya Hatao
Keywords:
Electronics
Materials science
Encapsulation (computer programming)
Composite material
bonding strength
Correction
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